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Executive Technical Program Committee

Michael Breadmore
University of Tasmania
AUSTRALIA
 Catherine Klapperich
Boston University
USA
Henrik Bruus
Technical University of Denmark
DENMARK
 James Landers
University of Virginia
USA
Yoon-Kyoung Cho
Ulsan National Institute of Science & Technology (UNIST)
SOUTH KOREA
 Abe Lee
University of California, Irvine
USA
Don DeVoe
University of Maryland
USA
 Susan Lunte
University of Kansas
USA
Dino DiCarlo
University of California, Los Angeles
USA
 Nicole Pamme
University of Hull
UK
Petra Dittrich
ETH Zürich
SWITZERLAND
 Je-Kyun Park
Korea Advanced Institute of Science and Technology (KAIST)
SOUTH KOREA
Jens Ducrée
Dublin City University
IRELAND
 Nuno Reis
Loughborough University
UK
Jan Eijkel
University of Twente
THE NETHERLANDS
 Kirsty Shaw
Manchester Metropolitan University
UK
Akihide Hibara
Tohoku University
JAPAN
 Manabu Tokeshi
University of Hokkaido
JAPAN
Noo Li Jeon
Seoul National University
SOUTH KOREA
 Fan-Gang Tseng
National Tsing Hua University
TAIWAN
David Juncker
McGill University
CANADA
 Aaron Wheeler
University of Toronto
CANADA
Noritada Kaji
Nagoya University
JAPAN
 Wouter van der Wijngaart
KTH Royal Institute of Technology
SWEDEN


Technical Program Committee

M. Teresa Fernández AbedulUniversidad de Oviedo, SPAIN
Fumihito AraiNagoya University, JAPAN
Karen CheungUniversity of British Columbia, CANADA
Nikos ChronisUniversity of Michigan, USA
Wendell ColtroFederal University of Goias, BRAZIL
Emmanuel DelamarcheIBM Research, SWITZERLAND
Stéphanie DescroixInstitut Curie, FRANCE
David EddingtonUniversity of Illinois, Chicago, USA
Alberto EscarpaUniversity of Alcala de Henares (Madrid), SPAIN
Shih-Kang FanNational Taiwan University, TAIWAN
Qun FangZhejiang University, CHINA
Olivier FreyETH Zürich, SWITZERLAND
Piotr GarsteckiPolish Academy of Sciences, POLAND
Thomas GervaisEcole Polytechnique de Montréal, CANADA
Edward GoluchNortheastern University, USA
Arum HanTexas A&M University, USA
Martin HegnerTrinity College Dublin, IRELAND
Chuck HenryColorado State University, USA
Han Wei HouNanyang Technological University, SINGAPORE
Tony Jun HuangPennsylvania State University, USA
Elliot HuiUniversity of California, Irvine, USA
Ville JokinenAalto University, FINLAND
Dong Sung KimPohang University of Science and Technology, KOREA
David KinahanDublin City University, IRELAND
Jeroen LammertynKatholieke Universiteit Leuven, BELGIUM
Séverine Le GacUniversity of Twente, THE NETHERLANDS
Chang-Soo LeeChungnam National University, KOREA
Chwee Teck LimNational University of Singapore, SINGAPORE
Che-Hsin LinNational Sun Yat-sen University, TAIWAN
Andreu LloberaInstitut de Microelectrónica de Barcelona (IMB-CNM, CSIC), SPAIN
Hongshen MaUniversity of British Columbia, CANADA
Kazuma MawatariUniversity of Tokyo, JAPAN
Matthias MeierUniversity of Freiburg - IMTEK, GERMANY
John OakeyUniversity of Wyoming, USA
Richard OleschukQueen's University, CANADA
Ian PapautskyUniversity of Cincinnati, USA
Sally PeymanUniversity of Leeds, UK
Darwin ReyesNational Institute of Standards and Technology, USA
Aman RussomKTH Royal Institute of Technology, SWEDEN
Tae Seok SeoKorea Advanced Institute of Science and Technology, KOREA
Tiina SikanenUniversity of Helsinki, FINLAND
Yuzuru TakamuraJapan Advanced Institute of Science and Technology, JAPAN
Sindy KY TangStanford University, USA
Mark TarnUniversity of Leeds, UK
Jonas TegenfeldtLund University, SWEDEN
Jaap den ToonderEindhoven University of Technology, THE NETHERLANDS
Marcel UtzUniversity of Southampton, UK
Rafal WalczakWroclaw University of Science and Technology, POLAND
Tza-Huei WangJohn Hopkins University, USA
Martin WiklundKTH Royal Institute of Technology, SWEDEN
Hongkai WuHong Kong University of Science and Technology, HONG KONG
Masumi YamadaChiba University, JAPAN
Takatoki YamamotoTokyo Institute of Technology, JAPAN
Hanry YuNational University of Singapore, SINGAPORE
Yong ZengUniversity of Kansas, USA
Xunli ZhangUniversity of Southampton, UK



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