MicroTAS 2017 Conference - October 22-26, 2017

Sponsors / Exhibits

Booth Availability

Industrial Stage

Technology Showcase Ads

Sponsor / Exhibitor
Prospectus

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Partow Technologies LLC
1487 Poinsettia Avenue, Suite 119
Vista, CA 92081 USA
phone: 1-760-536-3116
pr@partow-tech.com
www.partow-tech.com

Table Top

Partow Technologies provides room-temperature wafer bonding equipment and services. The company provides wafer bonding equipment for up to 100mm substrates based on atomic diffusion bonding method. The room temperature bonding allows bonding of dissimilar materials. The company products are used in compound semiconductor, photonics, MEMS, nanotechnology, and life science applications.